RA-062 - Sn62Pb36Ag2 Solder Paste (ROM0)

RA-062 - Sn62Pb36Ag2 more activity no-clean MT-range rosin activated solder paste (ROM0)

• More activity RA Sn62Pb36Ag2 solder paste. Small container for repair/rework, prototyping. Liquidus/Solidus point - 179ºC (Eutectic). Powder composition: 62% Tin, 36% Lead, 2% Silver. Melting point: 179°C
• High-quality leaded Sn/Pb solder powder made using virgin raw materials. Consistently shaped microscopic granules evenly suspended in a golden body of a rich in solids thick RA soldering tacky paste flux. Activates immediately, demonstrating professional industrial wetting on most PCB finishes, smooth dispensing, quick and efficient soldering/desoldering and effortless cleaning with IPA or Hot Air.
• RA solder paste can be applied as a BGA alternative or as a liquid solder for PCB repair and rework - delivers instant bridge-free reflow with Hot Air. Quick response to a soldering iron.
• Contains QC-Aid special optical tracer glowing in UV for immediate visual QC certification - paste will glow in UV highlighting applicable areas. QC-Aid - Everyone Can QC!