LT-HF-424 - Sn42Bi57.6Ag0.4 Low Temp Solder Paste (ROL0)
LT-HF-424 - Sn42Bi57.6Ag0.4 Low Temp Solder Paste (ROL0)
LT-HF-424 - Sn42Bi57.6Ag0.4 low-temperature solder paste lead-free halogen-free 0.4% silver rosin no-clean (ROL0)
Low-temp solder paste for electronics assembly.
Perfect for attachment of temperature-sensitive components to printed circuit boards, step soldering, warpage prevention, flexible circuits and large area array devices. Delivers reliable solder connections with low-temperature reflow.
Solders low-Tg flexible boards and circuits used in phones, wearables and IoT devices
Low-temp BGA paste reduces HIP (head-in-pillow) and NWO (non-wet-open) defects to minimum.